The company has grown since then to more than employees today. Our products help increase production efficiency, optimize processes and. The microDICE™ laser micromachining system leverages TLS-Dicing™.

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It is only because of our laser processes that efficient series production of new and innovative components and products are made possible. At the end of the project a throughput of Wafer per hour should be reached. With the growing adoption of new types of wafer substrates, thinner wafers and scaling to smaller dimensions and mkcromac substrates, wafer dicing is evolving as a critical value-add process step that not only ensures, but also further enhances, semiconductor device yields.

Setting Worldwide Standards in Laser Micromachining. Innovative laser processes are revolutionizing industrial manufacturing worldwide. Since we place great importance on continually expanding our know-how, we are diligent about keeping up with the latest research.

Production Solutions for Innovators and Growth Markets. The work is supported by five academic institute partners. This opens up a huge variety of possibilities and mircomac applications for BIPV.

3D-Micromac – Our Headquarter in Chemnitz, Germany

As a further challenge, laser cutting and structuring processes are developed for substrate separation and interconnection. By constantly optimizing all internal business processes, we set the course for the steady growth of our company and for a lasting partnership with our customers and suppliers.


Our technologies have set international standards for true innovation. As the first stand-alone, ultrashort pulsed laser-based tool for sample preparation, the microPREP systems bring additional unique capabilities, such as enabling large-area and 3D-shape sampling to allow for more comprehensive testing of complex structures.

Our target is to completely satisfy customer demands even on the most complex projects. We develop processes, machines and turnkey solutions at the highest technical and technological level. This immensely helps to reduce ramp-up times in production.

Firstly the developments are oriented to the state of the art.

Company – Laser Micromachining – 3D-Micromac AG

More-than-Moore MtMSystem-in-Package SiPas well as 3D high-density integration technologies are a prerequisite for enabling the design of compact microelectronic devices e. The on-the-fly processing guarantees highest productivity and an outstanding price-performance ratio.

Its mircomac throughput, outstanding edge quality and mm wafer capable platform enables a true high-volume production process, especially for SiC-based devices.

The microPREP systems an be micfomac for a variety of sample preparation techniques like SEM inspection of advanced-packaging devices, X-ray microscopy, atom probe tomography, and micro mechanics.

Laser Micromachining – 3D-Micromac AG

The main goal is to separate the cells without inducing damage at the cutting edge. Therefore, we are very proud to be certified miccromac the ISO quality standard since The constant cost pressure in the photovoltaic industry as a continues challenge to solar cell manufacturers can only be solved by increasing cell efficiency with simultaneous reducing manufacturing costs.


Our innovations are built on more than ten years of expertise in laser micromachining.

Strategic realignment focusing on industrial growth markets The project aims to develop large-scale lighting applications using organic light-emitting diodes OLEDs on flexible substrates. From the founding of our company until today we have constantly been able to achieve important milestones: Our aim is to provide superb customer satisfaction even for the most complex projects.

Approaches for precise local laser doping based on lean equipment concepts should be developed as well as a process based on a cost efficient infrared laser source. With the provision of the technology for crack-free separation of thin glass laminates, the 3D-Micromac AG is an important partner in the project. Opening of the company headquarters at the Chemnitz Technology Campus The micrommac technical challenges that make us grow.

More than excimer laser systems produced by 3D-Micromac AG are currently in industrial use. Those properties should be unchanged after cutting. As a result of the project, demonstrators are being developed that illustrate the power of the technology. Our products help increase production efficiency, optimize processes and lower costs in various areas of technology.

We also specialize in the use of excimer lasers for microprocessing.

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