IEEE 1101.2 PDF

in by IEEE Std in order to ensure interoperability and common good practices. Thanks to this standard, conduction cooled boards and chassis. Find the most up-to-date version of IEEE at Engineering (This foreword is not a part of IEEE Std , IEEE Standard for Mechanical Core Specifications for Conduction-Cooled Eurocards.) This document.

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Embodiments having frames that maintain the protrusion and still use a larger wedgelock for increased cooling efficiency are ueee contemplated, and are discussed below with respect to FIGS. The improved cooling efficiency is achieved, at least in part, through the use of a larger wedgelock It is a further object of the present invention to improve the cooling efficiency of the circuit card module by developing an adapter isee existing circuit card modules which provides a more direct path for the dissipation of heat from the components of the circuit card modules.

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IEEE – January

Thus, with an approximately 40 Watt W 11012, for example, there is an average 8. The reduction of thermal resistances and temperature rises is reflected in a reduced running temperature for component 6. The ieee of FIGS. Industrial communication networks – Profiles – Part However, in the event that the circuit card module is to be used in commercial non-military applications and convection cooled, then the wedgelock 3 would not be present.

Conduction cooled CompactPCI boards ready for insertion

However, formatting rules can vary widely between applications and fields of interest or study. The protrusion reduces the efficiency of heat removal by reducing the available conduction contact area and by reducing the size of the wedgelock that can be used.


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Optionally, the clamping force can be further increased by using a wedgelock 13 that has a friction-reducing finish applied to it and by installing the wedgelock 13 with washers. Accordingly, it is an object of the present invention to provide an adapter for COTS circuit card modules resulting in improved cooling efficiency.

Ieee two effects reduce the efficiency of movement of the heat to the cold wall of the chassis. This is due to iee ineffectiveness of conventional methods of controlling component junction temperatures under stringent temperature conditions. The problematic thermal resistances in the module of FIG. More specifically, the present invention relates generally to circuit card modules having frames that can be adapted to improve the cooling properties of the modules but 110.2 remain compliant with Institute of Electrical and Electronics Engineers IEEE specifications.

By Clarence Peckham Conduction cooling of circuit cards is a technology that has been used for many years in the military marketplace. In order to comply with the IEEE The following summary of the invention is provided to facilitate an understanding of some of the innovative features unique to the present invention, and is not intended to be a full description.

Add a review and share your thoughts with other readers. An improvement to an existing commercial off-the-shelf COTS circuit card module cooperating with a conduction-cooled chassis that receives the circuit card module resulting in increased cooling efficiency, the circuit card module having at least one printed wiring board PWBthe PWB having a protrusion at one end thereof, at least one component operatively connected to the PWB, a heat path between the component and the chassis, and a frame in contact with the PWB for stiffening the PWB, the improvement comprising:.


In particular, the frame 1 is extended with extension 16 to utilize the contact area 40the width of wedgelock 3 can be extended, and the strip 15 fully utilizes the space under the protrusion 4.

COTS circuit card modules generally have at least one printed wiring board PWBat least one component mounted on the PWB, a heatsink or some type of heat path, a frame for supporting the cards, and a wedgelock for use with a conduction-cooled chassis. Meyer, IV et al. Wedgelock device for increased thermal conductivity of a printed wiring assembly.

In most cases the mating surface is the wall of the systems enclosure. It should be noted that a reduction and simplification in thermal resistances is realized in the embodiment illustrated in FIG. 11011.2

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Your list has reached the maximum number of items. A plurality of electrical components 6 e.

Systems that could use a 6U form factor now had a standard bus architecture and mechanical standard based on the well understood and widely used VME architecture. Commercially-available, off-the-shelf components that are included in circuit card modules are often unreliable when exposed to the high temperatures present ieee, for example, the military environment.

There are several factors driving this interest in CompactPCI:.

Conduction cooled CompactPCI boards ready for insertion | GE Automation

Terms and conditions for Customized compilation of standards Contact us Accessibility. DE DET2 en Instead, the existing forced-air cooled chassis use the edge of the PWB as a guide and one of the mechanical attachment points for the chassis. This embodiment has a protrusion 14 and thus, is compliant with the IEEE Document, Internet resource Document Type:

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