JESD22 A103 PDF

JESDAE_电子/电路_工程科技_专业资料。JEDEC STANDARD High Temperature Storage Life JESDAE (Revision of. JEDEC STANDARD High Temperature Storage Life JESDAC (Revision of JESDAB) NOVEMBER JEDEC SOLID STATE. JESD A J-STD Preconditioning (PC): PC required for SMDs only. JESD A High Temperature Storage Life (HTSL). °C for hrs.

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Publications Department Wilson Blvd. Modified item C to remove reference of stress duration requirement.

JESDAC__High_Temperature_Storage_Life_百度文库

Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. The devices may be returned to room ambient conditions or hesd22 other defined temperature for interim electrical measurements.

If the change to a concept involves any words added or deleted excluding deletion of accidentally repeated wordsit is included. Degradation of metals including metallurgical interfaces. Requirement, clause number Test method number Clause number Fax: Table 1 — High temperature storage conditions Condition A: Other conditions and durations may be used as appropriate.

Degradation of metals includes metallurgical interfaces. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use jrsd22 those other than JEDEC members, whether the standard is to be used either domestically or internationally. Thermally activated failure mechanisms are modeled using the Arrhenius Equation for acceleration.

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During the test, accelerated stress temperatures are kesd22 without electrical conditions applied. During the test, accelerated stress temperatures are used without electrical conditions applied.

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Suite Arlington, VA 1. Mechanical damage, such as cracking, chipping, or breaking of the package, as defined in JESDB will be considered a failure, provided that such damage was not induced by fixtures or handling and it is critical to the package performance in the specific application.

Most of the content on this site remains free to download with registration. This test may be destructive, depending on Time, Temperature and Packaging if any. Some punctuation changes are not included. No claims to be in conformance with ejsd22 standard may be made unless all requirements stated in the standard are met. By downloading this file the individual agrees not to charge jrsd22 or resell the resulting material.

For example Glass Transition Temperature and thermal stability in air of any polymeric materials. Multiple Chip Packages JC If you can provide input, please complete this form and return to: The high temperature storage test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure mechanisms and time-to failure distributions of solid state electronic devices, including nonvolatile memory devices data retention failure mechanisms.

NC-A high-rate and lon Quality and Reliability of Solid State Products filter.

JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.

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Table 1 — High Temperature storage conditions Condition A: Requirement, clause number Test method number The referenced clause number has proven to be: This test may be destructive, depending on time, temperature and packaging if any. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint.

Some punctuation changes are not included. Filter by document type: For nonvolatile memories, the data specified data retention pattern must be written initially, and then subsequently verified without re-writing. Solid State Memories JC Cosmetic package defects and degradation of lead finish, or solderability are not considered valid failure criteria for this stress. Learn more and apply today. As a minimum the following items should be taken into consideration: The high temperature storage test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure mechanisms and time-tofailure distributions of solid state electronic devices, including nonvolatile memory devices data retention failure mechanisms.

I recommend changes to the following:

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